Key Features
- Very low solid flux containing ≤ 5.0% solids, providing very clean PCB’s
- Very active flux providing excellent wetting, flow & filling characteristics.
- Due to its low solid content residues is very minimal providing excellent electrical reliability.
DL NO CLEAN FLUX 810
PART NO: DL NFC 810
CHARACTERISTICS:
No clean flux is a very active, low solid flux based on Isopropyl alcohol, Proprietary activators &
other rheological agents that provides broad process window of solder operation for no clean
flux containing less than 5.0% solids. The flux contains very small amount of rosin to enhance
thermal stability during soldering. The residues post soldering are very minimal and are non
corrosive. The flux can be used for both Tin/Lead & Lead free solder baths.
FEATURES OF FLUX
Technical Specifications
| Appearance | Pale straw yellow |
|---|---|
| Form | Transparent Liquid |
| IPC-J-STD Designation | ROLO |
| Specific gravity @25⁰C | 0.795±0.005 |
| Solid content | 3.0 to 4.0% |
| Acid Value | 20±2 mg KoH |
| Corrosion test | Passes |
| Chromate paper test | Passes |
| Thinner | Recommended thinner |
| Flash point | 12⁰C |
| Shelf Life | 6 Months from date of manufacture |
Key Features
- Very low solid flux containing ≤ 3.0% solids, providing very clean PCB’s
- Very active flux providing excellent wetting, flow & filling characteristics.
- Due to its low solid content residues is very minimal providing excellent electrical reliability.
DL NO CLEAN FLUX 207
PART NO: DL NO CLEAN FLUX 207
CHARACTERISTICS:
No clean flux is a very active, low solid flux based on Isopropyl alcohol, Proprietary activators &
other rheological agents that provides broad process window of solder operation for no clean
flux containing less than 3.0% solids. The flux contains very small amount of rosin to enhance
thermal stability during soldering. The residues post soldering are very minimal and are non
corrosive. The flux can be used for both Tin/Lead & Lead free solder baths.
FEATURES OF FLUX
Technical Specifications
| Appearance | Pale straw yellow |
|---|---|
| Form | Transparent Liquid |
| IPC-J-STD Designation | ROLO |
| Specific gravity @25⁰C | 0.795±0.005 |
| Solid content | 2.8 to 3% |
| Acid Value | 18.5±1 mg KoH |
| Corrosion test | Passes |
| Chromate paper test | Passes |
| Thinner | Recommended thinner |
| Flash point | 12⁰C |
| Shelf Life | 6 Months from date of manufacture |
Key Features
- Very low solid flux containing ≤3.0% solids, providing very clean PCB’s
- Very active flux providing excellent wetting, flow & filling characteristics.
- Due to its low solid content residues is very minimal providing excellent electrical reliability.
DL NO CLEAN FLUX 310
PART NO: DL NFC 310
CHARACTERISTICS:
No clean flux is a very active, low solid flux based on Isopropyl alcohol, Proprietary activators &
other rheological agents that provides broad process window of solder operation for no clean
flux containing around 3.0% solids. The flux is colourless & clear. The residues post soldering
are very minimal and are non corrosive. The flux can be used for both Tin/Lead & Lead free
solder baths.
FEATURES OF FLUX
Technical Specifications
| Appearance | Colourless, clear liquid |
|---|---|
| Form | Transparent Liquid |
| IPC-J-STD Designation | ORLO |
| Specific gravity @25⁰C | 0.795±0.005 |
| Solid content | 2.90-3.30% |
| Acid Value | 18±2 mg KoH |
| Corrosion test | Passes |
| Chromate paper test | Passes |
| Thinner | Recommended thinner |
| Flash point | 12⁰C |
| Shelf Life | 6 Months from date of manufacture |
Key Features
- Very low solid flux containing around 2.0% solids, providing very clean PCB’s
- Very active flux providing excellent wetting, flow & filling characteristics.
- Due to its low solid content residues is very minimal providing excellent electrical reliability.
DL NO CLEAN FLUX 611
PART NO: DL NO CLEAN FLUX 611
CHARACTERISTICS:
No clean flux is a very active, low solid flux based on Isopropyl alcohol, Proprietary activators &
other rheological agents that provides broad process window of solder operation for no clean
flux containing around 2.0% solids. The flux is colourless & clear. The residues post soldering
are very minimal and are non corrosive. The flux can be used for both Tin/Lead & Lead free
solder baths.
FEATURES OF FLUX
Technical Specifications
| Appearance | Pale straw yellow |
|---|---|
| Form | Transparent Liquid |
| IPC-J-STD Designation | ROLO |
| Specific gravity @25⁰C | 0.795±0.005 |
| Solid content | 2.8 to 3% |
| Acid Value | 18.5±1 mg KoH |
| Corrosion test | Passes |
| Chromate paper test | Passes |
| Thinner | Recommended thinner |
| Flash point | 12⁰C |
| Shelf Life | 6 Months from date of manufacture |
Key Features
- High solid flux containing around 36.0% solids, providing good wetting & soldering.
- Very mildly activated flux providing excellent wetting, flow & filling characteristics.
- The solids post soldering are non corrosive providing good electrical reliability.
DL RMA 031 FLUX
PART NO: DL RMA 031
CHARACTERISTICS:
RMA flux is a very mildly activated, rosin containing flux based on Isopropyl alcohol, Proprietary
activators & other rheological agents that provides broad process window of solder operation
for RMA flux containing around 36.0% solids. The flux contains very small amount of halide to
promote good soldering. The residues post soldering are non corrosive. The flux can be used
for both Tin/Lead & Lead free solder baths.
FEATURES OF FLUX
Technical Specifications
| Appearance | Amber Brown |
|---|---|
| Form | Transparent Liquid |
| IPC-J-STD Designation | ROLO |
| Specific gravity @25⁰C | 0.885±0.005 |
| Solid content | 36.0% ±2.0 |
| Acid Value | 35±2 mg KoH |
| Corrosion test | Passes |
| Chromate paper test | Passes |
| Thinner | Recommended thinner |
| Flash point | 12⁰C |
| Shelf Life | 6 Months from date of manufacture |